Intel has made an announcement at MWC 2015 of a collaboration with Ericsson, Samsung and others as part of a broad effort to get its new System-on-Chips (SoCs) into more phones out there.
Intel has a new range of SoCs, including the Intel Atom x3 for low-cost smartphones and tablets, and the Atom x5 and x7 series for premium devices. These SoCs incorporate Intel’s XMM 7360 LTE Advanced Solution, with support for LTE Cat 10 and speeds of up to 450 Mbps.
Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel’s first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.
Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS and Jolla, have committed to delivering Intel Atom x3 designs.
Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows and Android, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices.
Customers, including Acer, ASUS, Dell, HP, Lenovo and Toshiba, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.
Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel’s portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1 Gbps using Intel technology end-to-end.
It’s a fascinating insight into what the behind-the-scenes vendors are doing to increase our enjoyment and use of smart devices; Qualcomm have been the big name in this space for a while now, and it’s good to see Intel making a really solid and powerful transition from traditional desktop and mobile computing into the ultra-portable smartphone and tablet arena.