There was a time not so long ago that Huawei were considered a manufacturer of low end, low quality phones. Through a lot of hard work and investment in their manufacturing arm Huawei are now capable of producing phones capable of matching anyone. Both us and Huawei know that they are starting to hit the big time when leaks of their upcoming flagship create waves in the Android community.
Today new leaker extraordinaire, Onleaks has leaked a page from the early prototype manufacturing documents for the Ascend P8.
— Steve H.McFly (@OnLeaks) March 21, 2015
The page shows that the Ascend P8 will be a very thin device at only 6.6mm thick while being 144.90mm long and 71.90mm wide. For those who are not fans of the large phablets being made lately that should make you happy. There are holes also at the bottom of the phone for the speakers which is nothing out of the ordinary.
What is out of the ordinary is the rectangular strip on the back of the device. Most likely this is some form of fingerprint reader, with the fingerprint reader on their Ascend Mate 7 from last year being extremely robust and a pleasure to use. The reader seems very wide so there may be other functionality to this rectangle that will be revealed very soon at it’s release.
As well as these dimensions we also already “know” that the Ascend P8 will likely have a 1080p 5.2in display, powered by an octo-core Hisilicon Kirin 930 processor with 3GB of RAM and have a 13MP rear shooter and a front facing camera of 8MP for those high resolution selfies.
I for one am very interested in this device and will be putting my hand up to review it should the opportunity arise. Is it enough to tempt you away from one of the bigger-named manufacturers such as HTC, Samsung and LG?