We’ve been watching Oppo tease their upcoming handset launch for the last couple of weeks, and today Oppo has confirmed that the R7 will launch in Beijing on the 20th of May.
The phone will presumably launch alongside the Oppo R7 Plus, which leaked the other day – though whether the availability of the Plus sized model will reach outside of their core Asian markets isn’t certain.
— OPPO (@oppo) May 11, 2015
The Oppo R7 will feature an all metal unibody design, with either a 1.5 GHz 64-bit octa-core Qualcomm Snapdragon 616 processor, or a MediaTek 1.7GHz octa-core MT6752 processor powering the phone. The Plus model appears to follow the same design language of the R7, but adding a rear-mounted fingerprint sensor to the rear of the phone.
As the only western market that Oppo has entered, we hope to see the Oppo R7 at least hit our shores, and possibly the R7 Plus. We’ll know more about the availability and pricing on the handsets when they launch on May 20th.