Next week in Barcelona, Qualcomm will show off its second generation Snapdragon X55 5G modem to power the next generation of 5G smartphones and devices.
The Snadragon X55 5G modem is a single-chip multi-mode solution which allows manufacturers to combine any number of frequencies in devices, including the sub-6 GHz frequencies and 5G mmWave bands. This will allow manufacturers to build smaller, more capable devices with increased power efficiency.
The new chipset will support the next generation of connectivity for mobile devices, hotspots and fixed wireless devices (such as CPE modems) and always-connected devices like laptops, cars and more.
The best news? The Snapdragon X55 modem will support incredible speeds – up to 7GBps over the air – which will facilitate near-instant connection between the user and the cloud.
Competition is heating up in this space. It wasn’t long ago that Huawei announced its single-chip 5G modem which also includes 2G/3G/4G compatibility in the same single chip. It’s notable, though, that Huawei’s chip is rated for a maximum of 4.6Gbps, against Qualcomm’s 7Gbps.
Either way, we expected to be inundated with 5G news next week, so this is only the beginning.